Project |
Parameter |
Minimum line width / wire gap (Mil) |
3/3mil |
Minimum welding ring(Mil) |
Conventional unilateral size: 5mil, the minimum unilateral width after cutting copper: 4Mil |
Element hole single side size: 8Mil, cut copper after the minimum unilateral width for£º6mil |
Minimum aperture |
Mechanical hole |
0.10mm |
Laser hole |
0.075mm |
aspect ratio |
10:1 |
Maximum plate thickness |
Single, double panel |
6.0mm |
Multilayer board |
6.0mm |
Minimum plate thickness |
Single, double panel |
0.2mm |
Multilayer board |
4 layer: 0.4 mm; 6 layer: 0.6 mm; 8 layers: 1.0 mm; 10 layers: 1.2 mm |
Biggest size |
Single, double panel |
640 x1100mm |
Multilayer board |
640 x1100mm |
Line to board edge distance |
Milling shape:0.20mm |
V-CUT: 0.4mm |
Maximum number of layers |
24 layers |
Resistance welding |
Green window(Mil) |
2mil |
Green oil bridge(Mil) |
Green oil: 4mil, variegated ink: 5mil |
Colour |
White, black, blue, green, yellow, red, dumb black, dumb green and so on |
character |
Minimum line width(Mil) |
5mil |
Colour |
White, yellow, black and so on. |
Surface treatment |
Spray tin, nickel plating / gold, chemical nickel / gold, Shen silver, Shen tin, anti-oxidation and so on. |
Hole plating (micro inch) |
Copper layer thickness |
800 |
1000 |
Bottom copper thickness |
Inside and outside the copper thick£¨oz£© |
1/3 |
6 |
Finished copper thick |
Outer layer |
1 |
6.5 |
Inner layer |
0.5 |
6 |
Plate type |
FR4 |
High frequency plate |
Aluminum plate(Berquist,thermagon Made Al base) |
impedance |
Impedance tolerance range |
¡À5% |
Capacity project |
Metal substrate |
|
Soft and hard combination board |
|
Embedded capacitive board |
|
Embedded resistive plate |
|
IC package substrate |