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Production Capacity
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Production Capacity
Project Parameter
Minimum line width / wire gap (Mil) 3/3mil
Minimum welding ring(Mil) Conventional unilateral size: 5mil, the minimum unilateral width after cutting copper:   4Mil
Element hole single side size: 8Mil, cut copper after the minimum unilateral width for£º6mil
Minimum aperture Mechanical hole 0.10mm
Laser hole 0.075mm
aspect ratio 10:1
Maximum plate thickness Single, double panel 6.0mm
Multilayer board 6.0mm
Minimum plate thickness Single, double panel 0.2mm
Multilayer board 4 layer: 0.4 mm; 6 layer: 0.6 mm; 8 layers: 1.0 mm; 10 layers: 1.2 mm
Biggest size Single, double panel 640 x1100mm
Multilayer board 640 x1100mm
Line to board edge distance Milling shape:0.20mm
V-CUT: 0.4mm
Maximum number of layers 24 layers
Resistance welding Green window(Mil) 2mil
Green oil bridge(Mil) Green oil: 4mil, variegated ink: 5mil
Colour White, black, blue, green, yellow, red, dumb black, dumb green and so on
character Minimum line width(Mil) 5mil
Colour White, yellow, black and so on.
Surface treatment Spray tin, nickel plating / gold, chemical nickel / gold, Shen silver, Shen tin, anti-oxidation and so on.
Hole plating (micro inch) Copper layer thickness 800 1000
Bottom copper thickness Inside and outside the copper thick£¨oz£©  1/3 6
Finished copper thick Outer layer 1 6.5
Inner layer 0.5 6
Plate type FR4
High frequency plate
Aluminum plate(Berquist,thermagon   Made Al base)
impedance Impedance tolerance range ¡À5%
Capacity project Metal substrate
Soft and hard combination board
Embedded capacitive board
Embedded resistive plate
IC package substrate
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R & D, design and manufacture Copyright © 2006-2017  Shenzhen WeiliFa Electronics Co., Ltd.  ICP£º17035633